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RF/DC Sputtering Technique

This is a well established PVD technique for depositing materials by sputtering or magnetron sputtering. Substrates are loaded in a high vacuum which is pumped down to the appropriate process pressure. Plasma is generated when a negative charge is applied to the target material. Positively charged gas ions (Argon, Oxygen..) are attracted to negative biased target. The high speed collision creates a momentum transfer and ejects atomic sized particles which are deposited on the surface of the substrate.

Typical applications include:

  • Electronics\Semiconductors
  • Glass\Optics
  • Displays
  • Photovoltaïques

Vinci Technologies has designed a line of products for this technology.

       

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