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Six sources Magnetron Sputtering (3") Deposition System (PVD6)

The PVD6 is a Physical Vapor Deposition system dedicated to the sputtering deposition process of materials with up to 6 sources (3").
 Its evolutionary design is particularly adapted to laboratory requirements in terms of every day applications, its simplicity to use and its competitive price.

This system can also be equipped with a load lock chamber to reach a limit pressure in the range of 10-8 mbar and faster preparation time.

 

MAIN SPECIFICATIONS

  • Stainless steel chamber – 500 mm diameter
  • Fast Entry Frontal Door with viewports
  • Up to 6’’ substrate diameter with rotation, heating and cooling (see options)
  • Substrate polarization
  • Up to 6 sputtering sources 3" with pneumatic shutters
  • RF, DC or DC Pulsed source power supplies
  • Turbo pumping group
  • “Full range” and capacitive pressure measurement
  • Venting valve
  • Mass Flow Controller for Gas Line
  • Pressure regulation by throttle valve 
  • Supervision/ Process control: PC software connected to a PLC


PERFORMANCES

  • Thickness Homogeneity                                                                    ± 5%
  • Deposition Rate Reading Precision                                                  0.01 A
  • Vacuum Base Pressure (deposition chamber)                               10-8 mbar
  • Turbo pump                                                                                         550 L/s on N2

PVD-6 Sputtering System with Load lock

sputtering PVD system VINCI TECHNOLOGIES





Quick video how to transfer from loadlock to chamber