Description

The PVD-4 is a physical vapor deposition system, dedicated to the Evaporation or Sputtering deposition process of materials. Its evolutionary design is particularly adapted to laboratory requirements in terms of every day applications, as its simplicity to use and its competitive price.

Core system features:
* Stainless steel – 320 mm diameter cylindrical
* Fast Entry Frontal Door with viewport
* Sample holder for substrates up to 4” in diameter
* Water cooling to avoid excess heating

Deposition techniques available:

 Thermal evaporation:
* Evaporation by joule effect
* Up to 4 sources (boats, rods, baskets, filament, etc.)
* Cross contamination shields included

 Magnetron sputtering:
* 1” or 2” magnetron cathodes
*  Integrated pneumatic shutters
* RF, DC or DC pulsed source power supplies
* Up to 3 cathodes in sputter up configuration
* Mass flow controller for gas line
* Pressure regulation by throttle valve

 Hybrid configuration:
* Combined Sputtering & Evaporation processes
* Up to 2 evaporation sources & 2 sputtering cathodes

Organic configuration:
* Combined Organic & Inorganic Evaporation processes
* Up to 2 organic & 2 thermal sources