RF/DC Sputtering Technique
This is a well established PVD technique for depositing materials by sputtering or magnetron sputtering. Substrates are loaded in a high vacuum which is pumped down to the appropriate process pressure. Plasma is generated when a negative charge is applied to the target material. Positively charged gas ions (Argon, Oxygen..) are attracted to negative biased target. The high speed collision creates a momentum transfer and ejects atomic sized particles which are deposited on the surface of the substrate.
Typical applications include:
Vinci Technologies has designed a line of products for this technology.