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Two Sources Thermal Evaporation Deposition System (PVD2-E)

Two Sources Thermal Evaporation Deposition System(PVD2-EV) The Vapor Deposition systems PVD2 series have been designed to meet a demand for performance and simplicity at a low cost.This system is very suitable for achieving rapid thin films deposition. The PVD2 system can be equipped with thermal sources or sputtering sources or both at the same time allowing a wide range of materials.


MAIN SPECIFICATIONS
  • Stainless steel chamber – 200 mm diameter with 100mm viewport
  • Up to 4’’ substrate diameter with rotation (see options)
  • Up to 2 thermal sources with pneumatic shutters
  • Turbo pumping group
  • “Full range” pressure measurement
  • Venting valve
  • Supervision software
PERFORMANCES
  • Thickness Homogeneity                                                    ± 5%
  • Deposition Rate Reading Precision                                  0.01 A
  • Vacuum Base Pressure                                                       10-6 mbar
  • Pumping-down Time (10-6 mbar)                                     < 30 mn
  • Turbo pump                                                                         77 L/s on N2
Deposition system PVD2