PVD4+ H: Ebeam & Thermal Evaporation & Sputtering


The PVD4+ H system is an unparalleled achievement in physical vapor deposition technology, skilfully uniting Ebeam (or E gun), thermal evaporation, and magnetron sputtering within a single sophisticated platform. This advanced hybrid system is optimally designed to meet the intricate demands of contemporary material science research, offering unparalleled versatility for thin-film deposition. It is adept at handling a myriad of applications, from semiconductor equipment research to the tailoring of optical coatings, rendering it an essential asset for pioneering R&D laboratories focused on surface and coatings technology and vacuum evaporator-based applications.


* Deposition System: Intelligently engineered to combine a certain number of sources on one platform from the following list - Ebeam evaporation, thermal evaporation, and magnetron sputtering, enabling a wide array of materials and deposition techniques, crucial for electron beam evaporation and physical vapor deposition coating.

* Enhanced Substrate Flexibility: Accommodates up to 6” diameter samples with features for rotation, and heating up to 900°C, essential for achieving thin film coating and thin film deposition with exceptional uniformity.

* Modular Design: Engineered for easy integration into clean rooms with an option to include load locks, this design significantly boosts throughput and operational efficiency in vacuum metal deposition and e gun applications.

* Superior Vacuum Performance: Achieves base pressures in the 10-7 to 10-8 mbar range using a robust turbo pump, ensuring a pristine vacuum chamber environment for metal and oxide growth.

* Intuitive Control Software: Features user-friendly software for comprehensive process supervision, facilitating precise control over deposition parameters, vital for surface and coatings technology and semiconductor equipment.


* Unparalleled Material Scope: Capable of depositing an extensive range of materials with precision, from metals and oxides to organics, supporting diverse research endeavours in metal and oxide growth for semiconductor equipment.

* Precision and Reliability: Offers meticulous control over film thickness, composition, and uniformity, critical for the fabrication of high-performance devices and materials in physical vapor deposition.

* Comprehensive System Supervision: Allows for complete oversight of the system, including pumping, venting, and the execution of complex recipes, ensuring a smooth and efficient operation for vacuum chamber Device securities are managed via program logic interface (PLC), independent of GUI supervision software for optimised system safety.

* Streamlined Research Workflow: Maximizes productivity by allowing the combination of different deposition techniques in a single workflow, enhancing vacuum metal deposition and ebeam applications.

* Ease of Use and Maintenance: Ensures straightforward operation and maintenance, reducing downtime and enhancing lab efficiency, particularly in magnetron sputtering and thermal evaporation processes.

The integration of Ebeam, thermal evaporation, and sputtering technologies within the PVD4+ H system underscores Vinci Technologies' dedication to pioneering advancements in thin-film deposition. This system presents an unmatched blend of versatility, performance, and user-friendliness, empowering researchers to explore new horizons in material science and engineering.