PVD4 H: Organic / Inorganic Evaporator (Advanced Coating Technologies)


The PVD4 system represents a significant leap forward in physical vapor deposition technology, specifically engineered for material growth applications pivotal in advanced coating technologies. Uniquely designed to meet the versatile needs of laboratory settings, this system excels in its hybrid configuration that supports both low temperature (for organics) and high temperature (for inorganics) thin film evaporation, making it an essential tool for 3D batteries, Perovskite OPVs, OLEDs, and semiconductor equipment research.


* Versatile Deposition Techniques: Supports an array of deposition methods including high temperature and low temperature thermal evaporation, crucial for physical vapor deposition coating and thin film coating, with a flexible hybrid configuration for combined processes.

* Multiple Source Options: Accommodates up to 4 sources for thermal evaporation (boats, rods, baskets, filament, etc.), equipped with cross-contamination shields and options for organic and inorganic materials, facilitating advanced coating technologies.

* Comprehensive Substrate Support: Features a sample holder for substrates up to 6 inches in diameter, ensuring thickness homogeneity within +/-2% at a working distance of about 300mm, essential for semiconductor equipment applications.

* Optimized Vacuum and Pumping System: Achieves a base vacuum chamber pressure of 10-7 mbar with a turbo pump rated at 300 L/s on N2, ensuring rapid pumping-down times of less than 20 minutes to 10-6 mbar, crucial for physical vapor deposition processes.


* Enhanced Efficiency: The system's fast pumping speed and advanced pressure management capabilities ensure quick preparation and precise control over the vacuum chamber environment, significantly benefiting physical vapor deposition.

* Superior Precision: With thickness and deposition rate reading precision down to 0.1 A and 0.01 A respectively, the PVD4 enables meticulous thickness monitoring and material deposition control for thin film coating and thin-film deposition.

* Adaptability and Flexibility: The PVD4's evolutionary design supports a wide range of materials and deposition techniques, providing unparalleled flexibility in experimental design and application for advanced coating technologies.

* Comprehensive System Supervision: Allows for complete oversight of the system, including pumping, venting, and the execution of complex recipes, ensuring a smooth and efficient operation for vacuum chamber management. Device securites are managed via program logic interface (PLC), independent of GUI supervision software for optimised system safety.

* Compact and Ergonomic Design: Its compact footprint and intuitive operation make the PVD4 an ideal addition to any laboratory, maximizing space without compromising on functionality or performance, especially in physical vapor deposition coating and vacuum metal deposition.

The PVD4 Four Sources Physical Vapor Deposition System is engineered to empower researchers and scientists with a versatile, high-performance tool for advancing material science and engineering projects. By combining sophisticated technology with ease of use and efficiency, the PVD4 stands as a critical asset in any research and development environment, pushing the boundaries of innovation in physical vapor deposition, advanced coating technologies, and thin-film deposition.