MECATRANS Transfer Tunnel for Ultrahigh Vacuum


The MECATRANS system marks a revolutionary development in thin films research and applied technology, embodying the forefront of materials science. It facilitates integrated workflow of deposition growth, analysis, sample preparation and post-deposition treatments systems under one unique Ultrahigh Vacuum (UHV)  environment. It accommodates sample transport from system to system so that users can design materials from atomic/nano-scale all the way to macrostructures. Samples move through the UHV tunnel on an internal monorail, allowing for efficient exchanges between the sample carriage and connected chambers, equipped with vacuum valves and load locks for contamination-free transfer. The MECATRANS is tailored to support several two, three or four inch sample platens, maximizing throughput and versatility in sample processing. A miniature version for the transport of  solely small pieces such as flag-style (5x5, 5x10, 10x10mm) samples also exists.


* Ultra-High Vacuum Tunnels: Ensures 10 mbar vacuum tunnels, providing a pristine substrate transfer environment, crucial for minimizing contamination risks.

* Magnetic Coupling: Features friction-free movement via magnetic coupling, essential for eliminating particle contamination and ensuring a clean transfer within the vacuum chamber.

* Advanced Pumping Group: Incorporates ion pumps and turbomolecular pumps, maintaining optimal Ultrahigh Vacuum conditions.

* High-Capacity Transport: Heralds a train-carriage system capable of transporting up to several substrates simultaneously, utilizing load locks to enhance efficiency and maintain UHV integrity.

* Rapid Transport Speed: Achieves a high transport speed of 50 cm/s in manual operation, critical for reducing transfer time and increasing throughput in semiconductor equipment. Automation of transfer as an option.

* Durable Construction: Constructed from high-quality 304L/316L stainless steel, ensuring durability and resistance to high temperatures in UHV conditions.

* Versatile Substrate Holders: Supports two, three or four inch sample platens or special substrate holders, offering flexibility for a range of research requirements.

* High-Temperature Bakeout: Capable of 200°C bakeout temperature, facilitating thorough vacuum preparation and cleaning, supported by effective vacuum valves.

* Customizable Design: Provides customizable lengths to accommodate specific laboratory or research facility needs, integrating seamlessly with existing UHV systems.

* Low Maintenance: Designed for easy maintenance, significantly reducing downtime and operational costs, thanks to reliable vacuum valves and ion pumps.

* Automated Motion: Offers optional automated motion for the transfer train, enhancing ease of use and consistency in sample handling, an advantage for semiconductor equipment


* Streamlined Workflow: Integrates multiple processes under Ultrahigh Vacuum conditions, streamlining research workflows and improving efficiency, particularly in semiconductor equipment.

* Contamination-Free Transport: Magnetic coupling and ultrahigh vacuum conditions ensure contamination-free sample transport, a cornerstone for high-quality thin film deposition.

* High Throughput: The capability to transport multiple substrates simultaneously significantly boosts experimental throughput, supported by efficient load locks.

* Flexibility and Customization: Customizable tunnel lengths and versatile substrate holders meet diverse research needs, enhanced by the modular use of vacuum valves.

* Reduced Operational Costs: Durable construction and low-maintenance design lead to reduced operational costs and increased longevity of the system.

* Enhanced Research Capabilities: Automated motion and high-speed transport expand research facilities' capabilities, allowing for more rapid experimentation and analysis.

The MECATRANS Transfer Tunnel and Cluster System represents the pinnacle of materials science innovation, offering researchers unmatched control and efficiency in the development of novel materials and technologies. Its comprehensive features and benefits underscore its indispensable role in cutting-edge research in Thin Films and associated disciplines.