Description

The PVD8 is a Physical Vapor Deposition system dedicated to the sputtering deposition process of materials with up to 8 sources (2").  Its evolutionary design is particularly adapted to laboratory requirements in terms of every day applications, its simplicity to use and its competitive price. This system can also be equipped with a load lock chamber to reach a limit pressure in the range of low 10-8 mbar and faster preparation time.

 The system maily includes:

* Cylindric stainless steel chamber
* Fast Entry Frontal Door with viewports
* Up to 6’’ substrate diameter with rotation, heating and cooling (see options)
* Substrate polarization (DC or FR bias)
* Up to 8 sputtering sources 2" with pneumatic shutters
* Sputter up or down confocal configuration
* RF, DC , Pulsed DC , Hipims  source power supplies
* Secured Turbo pumping group
* Full range and capacitive pressure measurement
* Pneumatic Venting valve
* Mass Flow Controller for Gas Lines
* Pressure regulation by throttle valve
* Supervision/ Process control: PC software connected to a PLC

A thesis from Institut Jean Lamour is available: Thesis